SiGe Analog/Rf/Mixed-Signal Asic Development Team Lead

The successful candidate needs demonstrated ability to lead our SiGe Analog/RF/Mixed-Signal Asic development team, projects and shall possess a broad knowledge in analog & RF circuit/chip design with the focus on high performance, high frequency, and low noise broadband TX (MZMD), RX (TIA), and other supporting circuits.

He or she should have abundant experience in managing a diverse technical team and bringing innovation to a fast-paced product environment from definition to design and production.

Essential Functions and Key Responsibilities:

• Lead the Analog/RF Asic Design Team in defining the product, chip architecture, design, foundry selection/interactions, test and productization.
• Manage and scale the team to deliver Analog/RF Asic solutions in support of Nokia's development of optical engines.
• Enhance and rigorously execute on design methodologies and processes to achieve the highest product quality.
• Guide the team in exploring the optimal topology for our applications to enable our products to become market leaders.
• Work with cross-functional teams to understand and define product requirements and plans.
• Lead interactions with internal and external teams and vendors on foundry, packaging, test, and qualification efforts
• In charge of many aspects of IC/Chip product development (spec, design, layout, tape-out, silicon bring-up, test, reliability, etc.)
• Work closely with verification, CAD, product, and test engineering teams to devise and conduct DVT plans and characterization.

Mandatory Knowledge/Skills/Abilities:

• Proven track record of analog/RF/mixed-signal SiGe BICMOS, CMOS ICs design and productization
• Experienced in managing/leading a diverse team of strong individual contributors.
• Abundant knowledge in high-speed, high-performance, low-noise Analog/RF circuitry, including low-noise amplifiers, TIA, MZMD, and related functions
• Good understanding of Analog/RF/mixed signal layout techniques and best practices.
• Solid understanding of 3D EM simulation tools (transmission lines and other high-frequency passive structures)
• Knowledge of RF wafer probing, lab equipment, and evaluation of high-speed analog ICs
• Decent knowledge of package and board-level design optimization.
• Fluent in verbal and written communications.
• Independently resolve issues to conquer organizational and technical challenges.
• Self-motivated, self-driven with attention to details.
• Experience leading cross-functional teams with direct people-management responsibilities

Education and Experience Requirements:

M.S. or Ph.D. in E.E. with 15+ years of related experience

Infinera is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, sex, color, religion, sexual orientation, gender identity, national origin, disability status, protected veteran status, or any other characteristic protected by law.